Product Type: FPC Soft Board
Manufacturing Process: Gold Plating/Silver Plating/OSP
Line Width and Line Spacing: ≥ 4mil
Board Thickness: 0.05 - 0.5mm
Copper Thickness: 0.5 - 2.0 OZ
Number of Layers: 1 - 10 layers
Product Type: FPC Soft Board
Manufacturing Process: Gold Plating/Silver Plating/OSP
Line Width and Line Spacing: ≥ 4mil
Board Thickness: 0.05 - 0.5mm
Copper Thickness: 0.5 - 2.0 OZ
Number of Layers: 1 - 10 layers