Material and process determine FPC’s service life and ultimate performance. Most low-end custom FPCs suffer from aging substrates, copper peeling, unstable impedance and poor heat resistance, damaging end-product quality. Focused on quality upgrade of custom FPC (www.szcxdz.cn), we renew raw material selection and core production processes to boost stability and durability, realizing full performance upgrade instead of only dimensional matching for custom FPC (www.szcxdz.cn).

We eliminate inferior base stocks and use high-grade imported Kaneka & DuPont PI plus rolled & electrolytic copper foil matched to customer demands. Low-Dk substrates reduce signal loss for 5G modules and high-frequency sensors; high-ductility rolled copper prevents cracks and open circuits on frequently bent circuits. Available surface finishes: ENIG, hard gold, HASL, OSP to fit various soldering and working conditions.

Precision FPC adopts LDI, vacuum etching and precision lamination, with line accuracy 0.05mm and layer alignment tolerance ±0.01mm. Custom parameters for impedance, shielding and stiffened boards avoid performance deviation. All products pass thermal cycling, flex fatigue and full electrical inspection, with steady yield above 98%.

We set four quality grades: consumer, industrial, automotive and medical for optional selection. Material traceability, parameter archiving and full finished-product inspection guarantee uniform performance, solving the industry pain of inconsistent quality and short service life for custom FPC.