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2026: High-frequency high-speed FPC market expansion, with AI terminals as the c
Time:2026.01.20 Font size

In 2026, the global electronics manufacturing industry is entering a critical period of structural upgrading. As a core component of flexible electronics, FPCs (Flexible Printed Circuits) are seeing explosive demand growth in AI terminals, foldable-screen devices, and high-frequency automotive scenarios, serving as a core driving force for industry development. According to the newly released 2026 Global FPC Industry Development Report by TrendForce, the global high-end FPC market reached USD 8.6 billion in the first quarter, up 35.2% year-on-year, with three major sectors—AI servers, foldable-screen smartphones, and automotive electronics—contributing over 70% of incremental demand. The main development trajectory of the FPC industry has shifted from past capacity expansion to a high-quality development phase characterized by "precision manufacturing + material breakthroughs." Manufacturers with capabilities in mSAP (modified Semi-Additive Process), high-frequency material R&D, and precision processing hold significant competitive advantages.

By segment, the computing power upgrade of AI servers is driving surging demand for high-frequency, high-speed FPCs. Such FPCs must ensure stable, high-speed signal transmission, placing stringent requirements on substrate performance and circuit precision. At present, leading companies in the industry have achieved mass production with line width/line spacing of 15/15 μm, achieving gross margins 20–30 percentage points higher than those of ordinary FPCs. The continued market penetration of foldable-screen smartphones is also creating incremental demand for FPCs. Global shipments of foldable-screen smartphones are expected to exceed 120 million units in 2026, with FPC usage per unit reaching 18–25 pieces, primarily driven by hinge connections and flexible display drivers. Industry experts note that as electronic products continue to evolve toward "thin, light, short, and small" form factors, flexible FPCs—with their bendable, foldable, and high-density wiring characteristics—are becoming irreplaceable connection solutions. Furthermore, amid the global supply chain restructuring, FPC production capacity is further concentrating in China. The Pearl River Delta and Yangtze River Delta regions have formed complete industrial chains from base materials and copper foil to finished product manufacturing, with continued clustering advantages. This has steadily increased the global market share of China's FPC industry to over 65%. Over the next five years, FPC manufacturers with multi-layer board processing capabilities and high-frequency material handling capabilities will enjoy greater room for development.

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